Industry News | 2023-10-30 19:21:14.0
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
Industry News | 2023-05-03 09:01:22.0
Tresky GmbH from Hennigsdorf near Berlin will present its newly developed pre-sintering processes at this year's pcim EUROPE in Nuremberg. As assemblies with high-performance semiconductors represent a key technology for the global energy turnaround and electromobility, Tresky has been working on these manufacturing processes for some time and will present further product and process innovations in 2023 as part of additional development steps.
Industry News | 2022-10-06 18:58:55.0
MacDermid Alpha Electronics Solutions will present the technical paper: "Automotive Traction Module Attach by Silver Sintering - Process, Performance & Reliability" at the 39th International Electronics Manufacturing Technology (IEMT) Conference from October 19 - 21 in Putrajaya, Malaysia.
Industry News | 2014-04-08 12:02:53.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the International Workshop on WGB Power Electronics April 10-11 in Hsinchu, Taiwan. Dr. Lee will present The Status and Prospect of Silver Sintering Paste Development. This presentation will discuss the significance of silver sintering paste for high power semiconductor devices and its future potential .
Industry News | 2020-11-06 17:27:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Power Package Attach by Silver Sintering – Process, Performance & Reliability" at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.
Industry News | 2020-10-31 10:43:47.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting an"Introduction to Sintering Products" at the Step-by-Step Technical Conference on Thursday, November 5th, 2020 in Hangzhou, China.
Industry News | 2024-05-27 12:39:02.0
Heraeus Electronics will introduce its latest product innovation, the mAgic PE360 Silver Sinter Paste, in Hall 6, Booth 6-310 at PCIM Europe. The event will take place June 11-13, 2024 in Nuremberg, Germany. This latest advancement aims to revolutionize thermal performance in electronic manufacturing, addressing industry challenges head-on.
Industry News | 2020-11-10 15:08:25.0
Ormet Circuits Inc. announced the introduction of its new Ormet® DAP-491-1 Transient Liquid Phase Sintering (TLPS) paste. TLPSpastes are lead-free and high-temperature stable sintering solder systems for semiconductor packaging and assembly.
Industry News | 2023-09-04 13:25:54.0
Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project "KuSIn - Copper sinter processes using induction heating for electromobility applications", funded by the German Federal Ministry of Economic Affairs and Climate Action (BMWK).
Industry News | 2022-05-05 17:06:12.0
Heraeus Electronics today announced that Susanne Klaudia Duch, Project Leader Development - Copper Sinter Paste, and Dennis Ang, Global Product Manager - Die Attach and Sinter Products, Heraeus Electronics, will present during the E-Mobility Forum at PCIM Europe. The presentation entitled, "How Near is Copper Sintering?" is scheduled to take place May 10, 2022 at 11:20 a.m.
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