Industry News | 2010-04-29 08:33:15.0
SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits
Industry News | 2010-06-18 07:36:04.0
Successful SMT/Hybrid/Packaging show
Industry News | 2010-05-04 08:04:45.0
After the highly successful introduction of its SIPLACE SX1 and SX2 placement machines featuring swappable gantries (“Capacity-on-Demand”), Siemens Electronics Assembly Systems will unveil the new SIPLACE SX4 at the SMT/Hybrid/Packaging trade show in Nuremberg, Germany (June 6-8, 2010; Hall 7, Booth 204).
Industry News | 2010-05-21 13:26:39.0
Televés invested once again in a new SMT production line consisting of the latest SIPLACE SX2 and SIPLACE CA machines
Industry News | 2009-05-29 12:27:20.0
Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
Industry News | 2013-03-12 13:42:20.0
With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.
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