Industry News | 2024-09-18 14:19:59.0
Make sure you head over to the catalog and place your best and final bids ASAP!
Industry News | 2009-03-19 15:52:21.0
Bernhard Fritz, 39, is the new head of product marketing at Siemens Electronics Assembly Systems GmbH & Ko. KG (SEAS). Fritz succeeds Holger Liebetruth, who is taking on other assignments within strategic marketing at Siemens AG.
Industry News | 2009-03-19 15:44:30.0
With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).
Industry News | 2010-05-11 15:39:58.0
"Emerging from the crisis with innovations and build-to-order" The signs of a recovery in electronics manufacturing are intensifying. For Ray Bruce, head of the global SIPLACE CRM organization, and his team, the goal is now to arrive at the right short-term and medium-term conclusions from the changes. Bruce also believes that manufacturers are now called upon to develop and support new production concepts.
Industry News | 2009-05-29 12:32:19.0
SIPLACE reference lines equipped with the new MultiStar CPP head deliver a continuous high level of line productivity, especially in high-mix production environments.
Industry News | 2010-11-08 23:01:06.0
To complete the wide-ranging SIPLACE Excellence restructuring program and prepare for the planned transfer of SIPLACE’s ownership from Siemens AG to ASM Pacific Technology, SIPLACE Head of Development Günter Schindler has been appointed Chief Operating Officer (COO) of the global SIPLACE team effective October 1, 2010.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2010-06-23 11:30:04.0
After more than seven years, SIPLACE head of Asian operations Siegfried Neubauer (46) returns to the headquarters of Siemens Electronics Assembly Systems GmbH & Co. KG (SEAS) in Munich.
Industry News | 2012-04-27 16:02:04.0
During private demonstrations visitors can see for themselves the highly flexible SIPLACE MultiStar head and the intelligent SIPLACE feeder set up. Live gantry exchange, offline vision and new productivity enhancing software will be additional focus points.
Industry News | 2013-05-22 11:40:13.0
With its brand-new SIPLACE Di-Series the SIPLACE team of ASM Assembly Systems now offers proven placement quality and maximum process reliability in combination with innovative software also in the low-price segment. Technological details which are rare in this segment, such as digital vision systems, single and dual conveyors and modern, multi-language station software, are standard features on the SIPLACE Di-Series. Available in versions with one, two and four gantries, the SIPLACE D1i, SIPLACE D2i and SIPLACE D4i guarantee quick and smart new product introductions as well as fast and accurate placement capabilities - down to 01005 components.
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