Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industry News | 2009-05-29 12:27:20.0
Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.
Industry News | 2006-02-23 10:25:26.0
The placement machine platform from Siemens Electronics Assembly Systems - the SIPLACE X-Series - was recognized by SMT magazine for innovation and excellence at the APEX/IPC Printed Circuits Expo.
Industry News | 2009-05-29 12:32:19.0
SIPLACE reference lines equipped with the new MultiStar CPP head deliver a continuous high level of line productivity, especially in high-mix production environments.
Industry News | 2009-03-19 15:44:30.0
With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm).
Industry News | 2013-05-22 11:40:13.0
With its brand-new SIPLACE Di-Series the SIPLACE team of ASM Assembly Systems now offers proven placement quality and maximum process reliability in combination with innovative software also in the low-price segment. Technological details which are rare in this segment, such as digital vision systems, single and dual conveyors and modern, multi-language station software, are standard features on the SIPLACE Di-Series. Available in versions with one, two and four gantries, the SIPLACE D1i, SIPLACE D2i and SIPLACE D4i guarantee quick and smart new product introductions as well as fast and accurate placement capabilities - down to 01005 components.
Industry News | 2010-04-29 08:33:15.0
SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits
Industry News | 2010-04-28 11:15:51.0
SIPLACE SX wins two more awards and receives excellent feedback
Industry News | 2010-11-16 12:27:02.0
Turck Deléémont is investing in two state-of-the-art SIPLACE machines from the successful X-Series to get ready for the rising order volume at its location in Delémont, Switzerland.
Industry News | 2010-05-21 13:26:39.0
Televés invested once again in a new SMT production line consisting of the latest SIPLACE SX2 and SIPLACE CA machines
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