Industry News: sloder paste height measurement (Page 1 of 12)

Omron Demos High-Speed PCB Inspection Technology Solutions at the 2012 IPC Midwest Conference & Exhibition

Industry News | 2012-08-03 08:30:27.0

Omron Inspection Systems (www.omron247.com) will display and demo its latest concepts and enhancements in AOI systems at the 2012 IPC Midwest Conference & Exhibition

Association Connecting Electronics Industries (IPC)

IPC RELEASES PCB INDUSTRY RESULTS FOR JULY 2011

Industry News | 2011-09-06 13:21:09.0

IPC announced the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

3-D solder paste inspection with Process Uplink function: More than just defect detection

Industry News | 2012-04-06 19:44:17.0

In SMT electronic assembly production, 3-D SPI has established itself as the additional inspection gate to complement optical or X-ray inspection.

Viscom AG

ASC International � New Solder Paste Inspection Systems

Industry News | 2008-01-28 21:46:16.0

Maple Plain, Minnesota, USA � ASC International announces the launch of the VisionMaster M450 & AP450 series solder paste inspection systems. Continuing with the long-standing history of success from the VisionMaster series of products, the newly released M450 and AP450 provide many new enhancements. A larger color field of view, data acquisition rates at less than 1 second and an improved user interface are only a few of the many improvements.

ASC International

CyberOptics to Display SE 300 Ultra� 3-D Solder Paste Inspection at Productronica 2007

Industry News | 2007-11-01 02:12:55.0

MINNEAPOLIS - October 31, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will feature SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth A4.262 with GPS Technologies at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at APEX 2008

Industry News | 2008-03-14 19:37:03.0

MINNEAPOLIS - March 2008 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2215 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at Nepcon Shanghai 2008

Industry News | 2008-04-07 21:53:22.0

MINNEAPOLIS - December 20, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in the West Hall L1, booth 1A26 - at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at ExpoElectronica in Moscow.

Industry News | 2008-04-08 23:15:05.0

MINNEAPOLIS - April 2008 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in distributor AssemRus booth number 13 Hall 104 at the upcoming ExpoElectronica exhibition and conference, scheduled to take place April 15-18, 2008 at the Crocus Expo, Moscow.

CyberOptics Corporation

CyberOptics to Exhibit SE 300 Ultra� 3-D Solder Paste Inspection at APEX 2009

Industry News | 2009-03-23 13:24:38.0

MINNEAPOLIS - March 2009 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will showcase SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

CyberOptics Corporation

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