Industry News | 2016-03-02 13:33:49.0
IPC announced today the January 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders slumped in January, but orders continued to outpace sales, bringing the book-to-bill ratio up to 1.04.
Industry News | 2013-06-28 18:52:56.0
IPC announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The PCB book-to-bill ratio stayed strong for the sixth consecutive month, remaining at 1.10, an indication that recovery from nearly a two-year slump may be starting.
Industry News | 2014-09-02 12:43:04.0
IPC Releases PCB Industry Results for July 2014. Sales and orders were weaker in July, but the book-to-bill ratio held steady at parity.
Industry News | 2014-10-29 16:10:58.0
IPC — Association Connecting Electronics Industries® announced today the September findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2016-04-01 14:34:54.0
IPC announced today the February 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales rebounded in February, outpacing orders and reducing the book-to-bill ratio to 1.02.
Industry News | 2017-12-04 15:11:43.0
IPC announced today the October 2017 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Positive year-over-year shipment and order growth continued October. The book-to-bill ratio remained high in October at 1.12.
Industry News | 2019-09-28 15:00:54.0
IPC — Association Connecting Electronics Industries® announced today the August 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales and order growth rebounded in August and the book-to-bill ratio strengthened to 1.02.
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2015-10-22 16:43:19.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
