Industry News | 2016-06-19 19:44:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2023-06-07 19:51:18.0
Funds would help ensure success of the CHIPS Act and Biden's "Presidential Determination" on PCBs
Industry News | 2009-03-26 16:12:24.0
Samsung/Dynatech is doing its part to help you increase your productivity and revenue with the addition of the SMP200 Screen Printer.
Industry News | 2019-07-18 08:39:37.0
Data I/O Corporation announced that Michael Tidwell will be joining the company as Vice President of Marketing and Business Development. Michael brings a wealth of experience in Software, Security and Product Management. Michael was previously head of Marketing and Business Development at Sansa Security, a leading SW security IP provider that was sold to ARM Holdings. Michael was also head of product marketing at the ARM IoT Services Group. Prior to Sansa, Michael was Vice President of Business and Market Development at BSQUARE Corporation. Michael is a Summa Cum Laude graduate of Georgia Tech with a degree in electrical engineering. He completed a MSEE at the University of Washington.
Industry News | 2011-02-02 11:44:55.0
Data I/O Corporation announced support for Panasonic NPM Surface Mount Placement Machines with the ProLINE-RoadRunner™. Customers with a Panasonic NPM model SMT machine can now plug the ProLINE-RoadRunner directly into the SMT placement machine and program memory devices just before placement on the circuit board.
Industry News | 2020-12-04 18:57:48.0
Data I/O's new SentriX Product Creator™ tool for OEMs simplifies IoT security deployment for mission critical applications with support forInfineon OPTIGA™TPM with pre-configured security use cases
Industry News | 2001-08-23 10:44:26.0
George Guo to Serve as Vice President and General Manager for Tecnomatix-Unicam Subsidiary
Industry News | 2016-08-17 13:18:12.0
ADLINK Technology introduced its latest network appliance with the most flexible I/O options currently available on the market. With eight NIM (Network Interface Module) slots and five 2.5’’ HDD drive bays, the CSA-7200 offers extended configuration possibilities for the network security market and is our initial network appliance built using MICA (Modular Industrial Cloud Architecture), which enables fast reconfiguration and reduces time-to-market for new applications.
Industry News | 2017-01-20 20:03:05.0
ADLINK Technology introduces its VPX3010 Series rugged 3U VPX processor blade with 12-core Intel® Xeon® Processor D-1500 SoC for server-grade computing performance. A VPX3010 quick start kit and GPGPU companion products, such as an optional discreet VPX GPGPU blade or XMC module with the 384 CUDA core NVIDIA GeForce GT 745M GPU, help to reduce development risk and enhance the capabilities of the blade.
Industry News | 2013-09-18 12:09:19.0
ADLINK Technology today announced availability of the enhanced aTCA-6250 and aTCA-6200A, AdvancedTCA® (ATCA) processor blades with robust computing power, high throughput connectivity, and accelerated packet processing capabilities.
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