Industry News | 2017-09-07 02:02:38.0
ADLINK Technology has introduced a new PCI/104-Express, Single Board Computer (SBC) featuring 6th Gen Intel® Core™ processors and supporting up to 16 GB of DDR4-ECC soldered memory. The CMx-SLx delivers ruggedness by design and offers an extended lifecycle for industrial automation, transportation, energy, and defense applications requiring ultra-rugged stability with the added benefit of lower power consumption.
Industry News | 2014-12-29 11:32:53.0
JTAG Technologies, a leader in innovative boundary-scan (IEEE Standard 1149.1) products delivering a broad line of software and hardware tools for test preparation, test execution, test result analysis, and in-system programming applications will demonstrate the latest solutions at IPC Apex 2015 San Diego at booth # 826 :
Industry News | 2017-02-01 13:24:30.0
ADLINK is pleased to invite you to join us at ICE Totally Gaming Exhibition at our booth N1-224. The event takes place 7th ~ 9th of February 2017 in London.
Industry News | 2014-01-20 12:10:43.0
ADLINK Technology Inc., a leading supplier of Application Ready intelligent Platforms and industrial building blocks, will present amongst other products the following new highlights at the Embedded World Show Nuremberg at booth 1/1-538.
Industry News | 2020-12-21 09:16:23.0
MA Series PCB Terminal Blocks have between 2 and 24 positions with a 3.50mm, 5.00mm, 7.50mm or 10.0mm pitch
Industry News | 2004-09-07 14:15:21.0
Configurable Anadigm� device helps to reduce component count while providing a high level of design flexibility.
Industry News | 2014-02-03 11:56:16.0
ADLINK Technology today announced availability of Revision 2 of PICMG’s COM Express® Carrier Design Guide. The Design Guide was updated by a special PICMG subcommittee to reflect the new signals adopted with the PICMG COM.0 R2.1 specification.
Industry News | 2003-11-20 13:29:11.0
SpacePC� 4200 CPU provides a small form factor 32-bit processor module with strong network and communication functionality for embedded systems apps
Industry News | 2020-08-22 04:19:37.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.
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