Industry News | 2003-06-11 08:00:48.0
IPC has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.
Industry News | 2015-07-06 10:34:12.0
The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.” This special feature will take place during both days of the SMTA International Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois on September 29 - 30, 2015.
Industry News | 2017-07-19 15:29:48.0
The SMTA and Chip Scale Review are pleased to announce the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2022-04-20 14:11:14.0
Nordson Electronics Solutions offers their latest dispensing, conformal coating, and selective soldering technologies at SMTConnect 2022
Industry News | 2020-04-14 19:07:23.0
ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.
Industry News | 2018-02-26 10:51:50.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2018 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Industry News | 2018-09-26 11:45:32.0
On September 13, representatives from the e-textiles ecosystem, including product innovators, material suppliers, electrical engineers and academia, came together for IPC E-Textiles 2018, a first-time e-textiles event for IPC. The workshop was developed by leaders from the e-textiles supply chain, who approached IPC to host a collaborative educational event for two converging industries—textiles and electronics.
Industry News | 2018-10-23 20:30:54.0
Changing technologies that are driving the electronics industry will take center stage throughout the IPC APEX EXPO 2019 technical conference and professional development sessions, which will take place January 26-31 at the San Diego Convention Center in San Diego, California. Registration is now open at www.IPCAPEXEXPO.org.
Industry News | 2024-04-15 11:05:25.0
IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2024. The Peter Sarmanian Corporate Recognition Award was presented to Summit Interconnect and the Stan Plzak Corporate Recognition Award was presented to Robert Bosch GmbH.
Industry News | 2016-04-20 18:15:34.0
Nordson ASYMTEK will present a triple-valve, closed-loop system to jet conformal coating, a UV oven to cure it, and an automated coating inspection system to verify the coating results at the SMT Hybrid Packaging Show in Nuremberg, Germany, in the smartTec stand 7-109 from 26-28 April 2016. Nordson ASYMTEK's award-winning Quantum® Q-6800 high-performance, large-format dispensing system will jet underfill as part of the show's Future Packaging Line at stand 6-434.
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