Industry News | 2003-04-18 08:31:57.0
Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.
Industry News | 2003-05-02 08:58:57.0
Bob Ferguson has been appointed PWB General Manager, North America.
Industry News | 2018-01-29 19:04:26.0
MIRTEC, “The Global Leader in Inspection Technology,” today announced that Norcott Technologies Ltd. purchased an MV-3 OMNI 3D AOI system.
Industry News | 2021-06-15 04:22:53.0
IPCs Connected Factory Exchange (CFX) standard defines communication between processes and devices for Industry 4.0. MIRTEC and Optel Software worked together to develop a CFX based interface between MIRTEC's AOI machines and Optel Software's MES system. The goal was to implement full AOI process control at test it at their mutual customer site, VIRTEX plant in Dallas, TX. The resulting CFX interface is vendor independent and will allow MIRTEC to interface with other MES systems, and Optel Software to interface with other AOI machines, with no changes.
Association Connecting Electronics Industries (IPC)
Industry News | 2020-08-07 07:29:43.0
The SMTA Capital Chapter is excited to host its first FREE webinar on Wednesday, August 19th. The webinar will include an informative presentation given by industry expert Norman Armendariz, Ph.D. of Raytheon Company on "DfR- Design for Rinse-ability: Effect of SMT Component Package Design on Cleaning Effectiveness."
Industry News | 2013-08-01 12:59:51.0
Count On Tools (COT) Inc has launched its interactive online catalog and redesigned Web site.
Industry News | 2018-02-26 10:51:50.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2018 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Industry News | 2016-10-04 19:16:23.0
Engineered Material Systems is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.
Industry News | 2014-02-11 15:25:57.0
Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.
