Industry News | 2010-03-30 16:26:27.0
AUBURN, Maine — March 23, 2010 — Consistently printing clear and crisp labels requires the proper cleaning maintenance of any thermal printer. KICTeam's introduction of the Seiko Instruments Smart Label Printer Cleaning Card which features Waffletechnology will maintain that clarity on Seiko Instruments thermal printers. This new product was designed specifically for the SLP family of thermal printers through a joint effort of Seiko Instruments USA, Inc. and KICTeam. This new cleaning card is a quick and almost effortless means of removing any leftover adhesive residue or paper dust that can deteriorate the legibility of the print.
Industry News | 2002-04-15 08:28:35.0
New Reader is the Ideal Data Transfer Solution Between Today's Portable Devices and Computing Systems
Industry News | 2013-06-18 06:59:26.0
StarChip®, today announced that it is currently sampling the SCF136H product, its latest SIM controller designed to serve the Native market. The addition of the SCF136H to its product portfolio makes StarChip a broad range supplier of SIM controllers delivering solutions for the whole Telecom market.
Industry News | 2012-06-05 15:47:34.0
Engineered Material Systems introduces 535-10M-1 UV Cured Adhesive formulated for disk drive camera module, optoelectronic and circuit assembly applications.
Industry News | 2013-01-21 08:57:51.0
Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
Industry News | 2013-02-26 16:18:07.0
Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.
Industry News | 2013-05-22 14:12:24.0
Engineered Material Systems, Inc. (EMS) debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.
Industry News | 2014-01-09 10:39:28.0
Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Industry News | 2014-03-31 16:21:29.0
Engineered Material Systems debuts its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Industry News | 2015-01-27 09:40:03.0
Engineered Material Systems is pleased to debut its 535-11M-3 UV cured epoxy. 535-11M-3 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications.
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