Industry News: smart card (Page 1 of 10)

Norcott Technologies Purchases Mirtec’s MV-3 OMNI to Strengthen Its Inspection Capability

Industry News | 2018-01-29 19:04:26.0

MIRTEC, “The Global Leader in Inspection Technology,” today announced that Norcott Technologies Ltd. purchased an MV-3 OMNI 3D AOI system.

MIRTEC Corp

MIRTEC and Optel Software Implement Full AOI-MES CFX Integration at VIRTEX

Industry News | 2021-06-15 04:22:53.0

IPCs Connected Factory Exchange (CFX) standard defines communication between processes and devices for Industry 4.0. MIRTEC and Optel Software worked together to develop a CFX based interface between MIRTEC's AOI machines and Optel Software's MES system. The goal was to implement full AOI process control at test it at their mutual customer site, VIRTEX plant in Dallas, TX. The resulting CFX interface is vendor independent and will allow MIRTEC to interface with other MES systems, and Optel Software to interface with other AOI machines, with no changes. 

MIRTEC Corp

IPC Names New Director of Communications

Industry News |

Association Connecting Electronics Industries (IPC)

2002-03-14 07:38:02.0

SMTA Capital Chapter to Host a FREE Webinar August 19th on "DfR- Design for Rinse-ability: Effect of SMT Component Package Design on Cleaning Effectiveness"

Industry News | 2020-08-07 07:29:43.0

The SMTA Capital Chapter is excited to host its first FREE webinar on Wednesday, August 19th. The webinar will include an informative presentation given by industry expert Norman Armendariz, Ph.D. of Raytheon Company on "DfR- Design for Rinse-ability: Effect of SMT Component Package Design on Cleaning Effectiveness."

Surface Mount Technology Association (SMTA)

Count On Tools Launches Redesigned Online Catalog and Web Site

Industry News | 2013-08-01 12:59:51.0

Count On Tools (COT) Inc has launched its interactive online catalog and redesigned Web site.

Count On Tools, Inc.

Four IPC APEX EXPO Exhibiting Companies Push Boundaries of Technology and Earn 2018 Innovation Awards

Industry News | 2018-02-26 10:51:50.0

IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2018 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Industry News | 2016-10-04 19:16:23.0

Engineered Material Systems is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.

Engineered Materials Systems, Inc.

Engineered Material Systems Debuts Low-Temperature Cure/Snap Cure Conductive Adhesive for Die-Attach Applications

Industry News | 2014-02-11 15:25:57.0

Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

StarChip Announces the Sampling of the SCF335H, its New Generation of SIM Controllers

Industry News | 2012-04-26 06:47:41.0

New generation of SIM controllers is designed to cover demands of USIM Java CardTM applications, with the SCF335H being the first product of a new family that will fully encompass the Telecom Smart Card ICs market

Starchip

StarChip is Sampling the SCF335H, its New Generation of SIM

Industry News | 2012-04-26 07:12:36.0

New generation of SIM controllers is designed to cover demands of USIM Java CardTM applications, with the SCF335H being the first product of a new family that will fully encompass the Telecom Smart Card ICs market

Starchip


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