Industry News: smd and packages (Page 1 of 127)

Heller Industries Opens New Office and Demo Center in Taoyuan, Taiwan

Industry News | 2023-03-30 22:45:02.0

Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.

Heller Industries Inc.

HELLER Participates at the Beijing Intelligent Manufacturing and SMT Technology Exchange Conference

Industry News | 2023-06-12 21:14:11.0

The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.

Heller Industries Inc.

Learn How to Improve Dispensing Reliability and Accuracy with GPD Global at SMTA International

Industry News | 2013-09-12 14:24:27.0

GPD Global will exhibit in Booth #215 at the upcoming SMTA International Exhibition. Company representatives will demonstrate the latest in dispense technology from GPD Global's PCD line of continuously volumetric dispense pumps, along with its compact, versatile NCM5000 jetting series.

GPD Global

Microscopes and Vision Products Suit SMD and PCB

Industry News | 2003-04-21 08:46:05.0

Kaisertech has added Meiji Techno microscopes and vision equipment to its range of electronic production equipment.

SMTnet

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

PCB East 2003 Announces Final Conference and Exhibition Program

Industry News | 2003-07-10 08:45:50.0

UP Media Group Inc. today announced the final schedule of events for the eighth annual PCB Design Conference East

SMTnet

MIRTEC to Introduce MV-9 SIP and MP-7 MICRO at SEMICON West

Industry News | 2014-06-22 19:12:37.0

MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.

MIRTEC Corp

Low-Cost UNIX- and PC-Based Boundary-Scan Upgrade for Agilent 3070 In-Circuit Testers

Industry News | 2003-04-03 08:51:07.0

Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming

SMTnet

MIRTEC Europe and pb tec solutions to Display the Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2014

Industry News | 2014-04-22 14:31:18.0

MIRTEC announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.

MIRTEC Corp

MIRTEC Europe and pb tec solutions to Display Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2015

Industry News | 2015-04-07 11:25:45.0

MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

MIRTEC Corp

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