Industry News: smd and packages (Page 1 of 115)

Learn How to Improve Dispensing Reliability and Accuracy with GPD Global at SMTA International

Industry News | 2013-09-12 14:24:27.0

GPD Global will exhibit in Booth #215 at the upcoming SMTA International Exhibition. Company representatives will demonstrate the latest in dispense technology from GPD Global's PCD line of continuously volumetric dispense pumps, along with its compact, versatile NCM5000 jetting series.

GPD Global

Microscopes and Vision Products Suit SMD and PCB

Industry News | 2003-04-21 08:46:05.0

Kaisertech has added Meiji Techno microscopes and vision equipment to its range of electronic production equipment.

SMTnet

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

PCB East 2003 Announces Final Conference and Exhibition Program

Industry News | 2003-07-10 08:45:50.0

UP Media Group Inc. today announced the final schedule of events for the eighth annual PCB Design Conference East

SMTnet

Low-Cost UNIX- and PC-Based Boundary-Scan Upgrade for Agilent 3070 In-Circuit Testers

Industry News | 2003-04-03 08:51:07.0

Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming

SMTnet

Shipley Company Announces New Appointments for Printed Wiring Board Business in North America and Europe

Industry News | 2003-05-02 08:58:57.0

Bob Ferguson has been appointed PWB General Manager, North America.

SMTnet

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

FPGAs and Microcontrollers

Industry News | 2018-10-18 10:34:11.0

FPGAs and Microcontrollers

Flason Electronic Co.,limited

International Wafer-Level Packaging Conference and Exhibition

Industry News | 2011-01-18 14:37:31.0

Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.

Surface Mount Technology Association (SMTA)

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