Industry News: smd emi shielding assembly (Page 1 of 4)

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Nordson ASYMTEK Teams with Parker Chomerics for High-volume, Precision Conductive Coating Spray Application

Industry News | 2016-07-10 13:54:05.0

Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK to Present Paper on Dispensing for Chip-on-Wafer Packaging and Poster on Coating Applications for EMI Shielding at IMAPS Device Packaging Conference

Industry News | 2017-03-06 12:46:42.0

Nordson ASYMTEK will present a technical paper and poster session at the IMAPS Device Packaging Conference being held at the WeKoPa Resort & Casino in Scottsdale/Fountain Hills, Arizona, March 7-9, 2017.

ASYMTEK Products | Nordson Electronics Solutions

IPC to Host Fourth Annual Reliability Forum in Germany

Industry News | 2017-05-15 15:35:16.0

IPC will host Reliability Forum: Emerging Technologies from June 27-28 in Düsseldorf, Germany. This two-day event will address building reliability into electronic products utilizing newer technologies and processes in every phase of the product launch cycle.

Association Connecting Electronics Industries (IPC)

The Benefits of Embedded Discrete Components

Industry News | 2018-10-18 10:29:29.0

The Benefits of Embedded Discrete Components

Flason Electronic Co.,limited

DEK and Gore Introduce snapSHOT� Board-Level EMI Shielding Solution

Industry News | 2003-02-14 08:03:50.0

Provides Devices with Excellent Protection Against EMI and Overcomes Limitations of Metal Cans

ASM Assembly Systems (DEK)

New Yorker Electronics Distributes Exxelia Miniature Low-Pass Filter Capacitors

Industry News | 2020-12-21 09:11:22.0

Several Ranges of Miniature Filters with Different Low-pass Configurations were designed to Protect Electronic Equipment from Interferences

New Yorker Electronics

Krayden Inc. to Showcase Suppliers’ Technologies at the Assembly Technology Expo

Industry News | 2009-08-27 14:15:29.0

DENVER — August 2009 — Krayden, Inc., a leading distributor of engineered materials, announces that it will exhibit technologies from key suppliers in booth 1336 at the upcoming Assembly Technology Expo, scheduled to take place September 22-24, 2009 at the Donald E. Stephens Convention Center in Rosemont, IL. Products from Chromerics, Cytec, Dow Corning, FCT Assembly, Humiseal, Huntsman, Henkel/Loctite, Lord, MicroCare Corporation, Permabond, Techcon Systems, and Techspray will be on display in Krayden’s booth.

Krayden Inc.

Krayden Inc. to Showcase Suppliers’ Technologies at Space Coast SMTA Expo and Barbeque

Industry News | 2009-10-01 12:31:51.0

DENVER — October 2009 — Krayden, Inc., a leading distributor of engineered materials, announces that it will exhibit technologies from key suppliers at the upcoming Space Coast SMTA Expo and Barbeque, scheduled to take place Wednesday, November 4, 2009 from 10 a.m.-3 p.m. at the Lagoon House Education Center in Palm Bay, FL. Products from Chromerics, Cytec, Dow Corning, FCT Assembly, Humiseal, Huntsman, Henkel/Loctite, Lord, MicroCare Corporation, Permabond, Techcon Systems, and Techspray will be on display in Krayden’s booth.

Krayden Inc.

Engineered Materials Systems Introduces Low-Temperature Cure Conductive Adhesive for Static Drain and EMI/RFI Shielding Applications

Industry News | 2016-02-08 13:34:06.0

Engineered Materials Systems announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications.

EMS International Corporation

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smd emi shielding assembly searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155

SMT feeders

World's Best Reflow Oven Customizable for Unique Applications
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High Throughput Reflow Oven
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Assembly Automation Technology

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