Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2019-10-24 16:14:40.0
Essemtec announces that it was awarded a 2019 Mexico Technology Award in the category of Component Placement – Multi-function for its FOX2. The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
Industry News | 2012-06-25 12:57:32.0
New extension for Paraquda SMD placement machine released A new precision dispenser option allows the Paraquda high-speed pick-and-place from Essemtec to dispense up to 20,000 glue or paste dots per hour.
Industry News | 2020-04-23 11:07:52.0
Essemtec announces that its FOX2 smart-sized modular pick-and-place technology is expandable in any direction. The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.
Industry News | 2005-03-18 12:10:43.0
New pick & place series FLX2010-MK (MK=Membrane Keyboard)
Industry News | 2015-02-16 09:46:54.0
At the upcoming AUTOMATICON 2015 exhibition, taking place March 17 - 20 in Warsaw, Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its award-winning Paraquda in booth B28, hall 1. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and/or glue and mount components in one machine.
Industry News | 2009-07-17 19:02:35.0
The FLX2011-MK, Essemtec’s production center for flexible circuits and membrane keyboards, is now equipped with a jet valve dispensing system, allowing it to place smaller SMD components and LEDs on flexible circuits. The jet valve dispenses small glue dots more accurately and faster than others, and is contactless.
Industry News | 2017-07-27 13:42:24.0
Essemtec today announced plans to exhibit at the SMTA Capital Show, scheduled to take place on Aug. 24, 2017. The company will demonstrate the FOX2 that combines jetting of solder paste or glue and placement in a single machine.
Industry News | 2001-12-20 09:01:19.0
The new automatic pick&place system CSM7000 from ESSEMTEC is a precise machine for the assembly of SMD components onto printed circuits
Industry News | 2017-08-17 12:11:00.0
Essemtec today announced plans to exhibit in Booth #207 at SMTA International. The company will demonstrate the new FOX2 that combines jetting of solder paste or glue and placement in a single machine.
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