Industry News | 2017-03-09 22:28:20.0
GPD Global introduces its NEW Conformal Coating System (SimpleCoat), an Inline and Cost-effective Conformal Coating System with full featured programming - making conformal coating processes quick and easy.
Industry News | 2003-06-19 08:13:11.0
The new heads are capable of reaching an acceleration of greater than 20g.
Industry News | 2003-05-19 08:44:19.0
Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.
Industry News | 2003-03-04 08:08:23.0
In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.
Industry News | 2003-03-06 08:10:20.0
Astec Power has expanded its popular APC-Centauri surface-mount product line to include a series of 40W point-of-load DC/DC convertors.
Industry News | 2003-06-20 08:31:58.0
Leading chip timing solutions provider manufactures fast memory interface clock generators for high-bandwidth applications
Industry News | 2001-01-31 08:53:39.0
IPC reports that more than 6,900 attendees ventured to San Diego for the second IPC SMEMA Council Electronics Assembly Process Exhibition and Conference (APEXSM), held January 16-18. Of those attendees, more than 1,900 were from outside the United States, certifying APEX as an international event.
Industry News | 2010-04-10 02:24:51.0
IPC - Association Connecting Electronics Industries® honored Bob Black, president and CEO of Juki Automation Systems, Inc. with the coveted IPC President’s Award at IPC APEX EXPO™, April 6, 2010. This prestigious award is presented to IPC members who have exhibited ongoing leadership in IPC and have made significant contributions of their time and talent to the association and the electronics interconnect industry.
Industry News | 2019-11-03 15:33:45.0
Nordson Test and Inspection will exhibit in Hall A2, Stand 445 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. Systems from Nordson DAGE, MATRIX, SONOSCAN AND YESTECH will be available for demonstrations.
Industry News | 2009-12-17 18:14:12.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."
