Industry News: smt adhesive viscosity (Page 11 of 45)

Techcon to Show New Smart Dispensing Robot at Assembly Show

Industry News | 2018-09-26 12:06:36.0

Techcon will exhibit in Booth 545 at The Assembly Show, scheduled to take place October 23-25, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will display the TSR2000 Smart Dispensing Robot, along with their latest PC Pump, Smart Valve Controllers, and Dispensing Guns.

Techcon Systems

Reworkable Underfill Encapsulant for CSP's and BGA's

Industry News | 2003-09-25 13:32:47.0

Reduce waste and cost.

Zymet, Inc

Reworkable Underfill Encapsulant for BGA's

Industry News | 2004-04-27 15:19:57.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.

Zymet, Inc

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Industry News | 2018-01-28 20:07:34.0

Engineered Material Systems is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.

Engineered Materials Systems, Inc.

Techcon Systems Debuts TS1254 Pressure Pot

Industry News | 2010-11-24 13:42:19.0

Techcon Systems introduces the new TS1254 Pressure Pot. The new mid-sized pressure pot is designed to accommodate low to medium viscosity fluids, including solvents, adhesives and Cyanoacrylate (CA).

Techcon Systems

New Low-Temperature Curing Conductive Adhesive Available for OLEDs and OPVs

Industry News | 2012-04-05 13:59:12.0

Engineered Conductive Materials introduces the low-temperature curing Conductive Adhesive DB-1541-LTC for use in organic light emitting diodes (OLED) and organic photovoltaics (OPV).

ECM Equipment Sales, Inc.

ECM to Showcase Snap Cure Low-Cost Conductive Adhesives for Interconnecting Solar Cells at Intersolar NA 2012

Industry News | 2012-06-12 08:47:07.0

Engineered Conductive Materials, LLC,will exhibit the new low temperature curing Conductive Adhesive DB-1541-LTC in North Hall, Booth #5619 at the upcoming Intersolar North America conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Engineered Materials Systems, Inc.

Seika to Bring the Industry’s Top Manufacturing Equipment to SMTAI

Industry News | 2017-08-15 21:13:12.0

Seika Machinery today announced plans to exhibit in Booth #715 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. Seika will showcase a complete line up of leading-edge equipment, including the McDry DXU-401DP Pass Through Dry Cabinet, SAYAKA CT23NQ PCB Router, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM RCX Series and PCU-02V Spiral Viscometer. All equipment purchased on the show floor will receive special show pricing.

Seika Machinery, Inc.

Engineered Material Systems Introduces New Low-Temperature Cure Die Attach

Industry News | 2013-01-21 08:57:51.0

Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices

Engineered Conductive Materials, LLC


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