Industry News | 2018-09-26 12:06:36.0
Techcon will exhibit in Booth 545 at The Assembly Show, scheduled to take place October 23-25, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will display the TSR2000 Smart Dispensing Robot, along with their latest PC Pump, Smart Valve Controllers, and Dispensing Guns.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry News | 2018-01-28 20:07:34.0
Engineered Material Systems is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.
Industry News | 2010-11-24 13:42:19.0
Techcon Systems introduces the new TS1254 Pressure Pot. The new mid-sized pressure pot is designed to accommodate low to medium viscosity fluids, including solvents, adhesives and Cyanoacrylate (CA).
Industry News | 2012-04-05 13:59:12.0
Engineered Conductive Materials introduces the low-temperature curing Conductive Adhesive DB-1541-LTC for use in organic light emitting diodes (OLED) and organic photovoltaics (OPV).
Industry News | 2012-06-12 08:47:07.0
Engineered Conductive Materials, LLC,will exhibit the new low temperature curing Conductive Adhesive DB-1541-LTC in North Hall, Booth #5619 at the upcoming Intersolar North America conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Industry News | 2017-08-15 21:13:12.0
Seika Machinery today announced plans to exhibit in Booth #715 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. Seika will showcase a complete line up of leading-edge equipment, including the McDry DXU-401DP Pass Through Dry Cabinet, SAYAKA CT23NQ PCB Router, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM RCX Series and PCU-02V Spiral Viscometer. All equipment purchased on the show floor will receive special show pricing.
Industry News | 2013-01-21 08:57:51.0
Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
Industry News | 2003-04-24 09:58:05.0
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