Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2012-06-26 14:04:28.0
Techcon Systems today announced the addition of 32-pitch TS7000 model to the TS7000 Valve Series.
Industry News | 2019-03-31 20:58:34.0
PVA will exhibit at the exhibit at the SMTA Atlanta Expo, scheduled to take place Thursday, April 11, 2019 at the Atlanta Technology Park in Peachtree Corners, GA. Company representatives will discuss PVA’s Jet Coating and Meter-Mix Dispensing System.
Industry News | 2018-08-16 19:42:31.0
Anda Technologies USA, Inc., a leading provider of fluid application and custom design manufacturing equipment, features a line of precision high-performance fluid dispensing and underfill systems. iJet-Table Dispenser Models 250 & 350 are useful for many applications such as SMT and PCB packaging, underfill, semiconductor packaging, LED packaging, electromechanical assembly, as well as flat panel assembly. The machines boast a max speed of 600 mm/second and 0.02 mm precision and repeatability.
Industry News | 2011-06-16 14:47:02.0
Techcon Systems, a product group of OK International introduces its updated product catalog.
Industry News | 2018-03-26 21:05:47.0
Techcon will exhibit in Stand 1F38 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will display the TSR2000 Smart Dispensing Robot, new Smart Valve Controllers, TS8100 Series Positive Displacement Pump and TS5000/TS7000 Series Rotary Valves.
Industry News | 2019-01-05 17:00:12.0
Techcon today announced plans to exhibit in Booth #1314 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its TSR2000 Smart Dispensing Robots, TS8100-100 PC Pump with new controller, and TS5000DMP-DCX valve.
Industry News | 2019-08-13 06:43:28.0
Techcon today announced plans to exhibit at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. The company will showcase its TS8100 Series Progressive Cavity Pump, TS5000DMP-DCX Auger Valve, Smart Valve Controller Series and TSR2000 Smart Dispensing Robots in Booth 1E25. Additionally, attendees will be the first to preview the new Techcon Jet Valve and Controller, scheduled to launch later this year.
Industry News | 2023-09-25 18:46:15.0
Seika Machinery, Inc. is excited to announce its participation at SMTA Guadalajara, scheduled to take place on Wednesday, Oct. 25, 2023 at Expo Guadalajara in Guadalajara, Jalisco. Seika Machinery will present an impressive array of state-of-the-art solutions that cater to diverse manufacturing needs in Booth 803.
Industry News | 2019-10-21 16:33:11.0
Techcon is pleased to announce the launch of its new TS9800 Series Jet Valve Dispensing System that includes the TS9800 Piezo-actuated jet valve and TS980 Smart Controller. Unlike pneumatic jet valves and other contact dispensing solutions, the TS9800 Jet Valve utilizes Piezo, non-contact jetting technology for increased speed and reduced scrap during the dispensing process.
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