Industry News | 2009-03-23 13:20:34.0
The team at Ovation Products is preparing to showcase a whole host of innovative technologies on booth 1747 at this year's Apex exhibition, being held in Las Vegas over March 31st � April 2nd. The advanced technology developer will demonstrate its proven Magna-Print� universal squeegee blade system and Grid-Lok� automatic tooling solution, in addition to launching its brand new Stinger low volume adhesive dispenser live at the show.
Industry News | 2013-10-02 23:40:56.0
Ascentech LLC will exhibit the Gensonic UltraSonic Stencil Cleaner and the new Solder Saver at the upcoming SMTA International 2013. The Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.
Industry News | 2022-12-14 12:10:28.0
StenTech Inc. will introduce its new Advanced Nano Coating at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Additionally, the company will have its complete product line of various stencils and tooling on display – Meet with the StenTech team in Booth #2150!
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2009-04-09 23:44:35.0
The team at Ovation Products has much to celebrate at this year's Apex exhibition, not least being named as an SMT Vision Award winner in recognition of its innovative dispensing technology, Stinger�. Presented to Ovation Products Chief Technology Officer, Charlie Moncavage, during a ceremony at Las Vegas' Mandalay Bay Hotel on March 30th, the award reinforces Stinger's ability to transform conventional print platforms into dual function systems.
Industry News | 2013-04-26 11:20:47.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it was awarded a 2013 SMT China Vision Award in the category of AOI Inspection & Testing - AXI for its Jade FP X-ray Inspection System.
Industry News | 2015-04-21 15:58:48.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Inspection & Testing-Functional Testing for its Camera Assist Automatic Bondtesting. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
Industry News | 2023-11-20 15:34:41.0
Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.
Industry News | 2013-03-18 17:06:13.0
AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
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