Industry News | 2018-06-11 18:56:42.0
Engineered Material Systems today announced that it will exhibit at the Intersolar Europa Solar Power Expo, scheduled to take place June 20-22, 2018 in Munich, Germany. The company will showcase its next-generation low cost conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules in Hall A2, booth 315.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2010-06-04 17:36:28.0
DENVER — Krayden, Inc., a leading distributor of engineered materials, introduces the Permabond TA459 magnet adhesive that is non-corrosive to electrically conductive surfaces including copper.
Industry News | 2021-02-24 11:47:14.0
YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2010-11-09 19:19:27.0
Krayden, Inc. debuts Dow Corning’s 3-6751 Thermally Conductive Adhesive used for bonding heat sinks to electronic devices and PCBs to substrates.
Industry News | 2008-04-07 19:26:19.0
Essemtec announces it will introduce the Nanojet Dispensing System, CDS6250 in distributor -------- booth ------ at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.
Industry News | 2015-08-27 09:41:13.0
Seika Machinery will exhibit in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Seika team will be available to demonstrate the following equipment: DEN-ON INSTRUMENTS CO., LTD. RD-500V Rework Station, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM SPS Solder Paste Mixer and MALCOM Spiral Viscometer.
Industry News | 2015-08-27 13:31:06.0
Seika Machinery will exhibit in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Seika team will be available to demonstrate the following equipment: DEN-ON INSTRUMENTS CO., LTD. RD-500V Rework Station, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM SPS Solder Paste Mixer and MALCOM Spiral Viscometer.
Industry News | 2017-01-24 13:50:40.0
The ProFlow 2K is a dual component dispenser designed for applying small volumes of 2-part adhesives in lines or dots with a high level of control.
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