Industry News | 2017-04-04 15:08:14.0
Hanwha Techwin Automation Americas, Inc., formerly Samsung C&T Automation, today announced the introduction of Flying Vision Verification to SM Plus component mounters. Flying Vision Verification utilizes on-the-head, upward-looking camera systems to verify presence of multiple components simultaneously following pickup, then verify alignment of multiple components simultaneously prior to placement, and finally verify placement of multiple components simultaneously in a single pick-and-place cycle for enhanced quality control, process efficiency, and performance.
Industry News | 2016-01-20 12:28:20.0
Through our ongoing technology agreement with AEGIS, Yamaha IM announces the completion of a software milestone: the full integration of Aegis FactoryLogix® software with Yamaha Programming PTools. This newly enhanced interface allows Aegis Software users the ability to create programs in FactoryLogix and directly hand them over to Yamaha’s Programming Tool (PTool).
Industry News | 2016-05-31 21:45:20.0
Yamaha IM America announces the launch of the new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the fastest placement rates and area productivity, at an unmatched 200,000 CPH: the fastest in the world.
Industry News | 2013-02-08 17:27:30.0
The Production Systems Division (PSD) of Hitachi High Technologies America, Inc. (HTA) announces the introduction of the first true innovation in the SMT component placement market in years with the industry's first automatic self-loading feeder, the SL. The 8mm SL Feeder provides splice-free continuous operation and resolves issues that have plagued electronics assembly customers for years caused by component reel splicing, including improperly spliced tape that interrupts production, and higher material and labor costs.
Industry News | 2021-09-23 02:15:05.0
HAYWARD, CALIFORNIA - SEPTEMBER 2021 ViTrox Americas, Inc., a wholly-owned subsidiary of ViTrox Corporation Berhad, manufacturer of the Most Trusted Machine Vision Inspection Solutions, is consistently the best 3D In-line AXI Solutions provider in the PCBA SMT Assembly. ViTrox today announced the appointment of Joshua Glover as an addition to the Technical Support Engineering team catering to ViTrox's growing customer base in the USA region.
Industry News | 2019-04-01 19:56:55.0
SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.
Industry News | 2015-10-13 19:27:42.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (
Industry News | 2015-10-22 16:43:19.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
Industry News | 2015-12-16 18:10:21.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature–sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2016-03-10 18:40:47.0
SHENMAO proudly announces a series of Lead-free LED Die Bonding Solder Pastes made locally in the USA and with the same quality in 8 other worldwide locations for various Die Bonding processes. Powder Size is available from T3 to T8.
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