Industry News | 2015-03-10 11:09:24.0
Essemtec AG, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit at booth #7.135 at SMT/HYBRID/PACKAGING, scheduled to take place May 5-7, 2015 in Nuremberg. Company representatives will demonstrate the latest generation of Paraquda pick-and-place system and Scorpion dispensing system. Other highlights will be the new SMT storage device Cubus Large and the new highly flexible and cost-effective pick-and-place system Lynx.
Industry News | 2008-04-29 22:48:29.0
LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will host an open house and the SMTA Boston Chapter meeting at its Littleton facility from 5:30-9 p.m. on Tuesday, May 20, 2008.
Industry News | 2013-11-12 16:12:53.0
Juki Automation Systems announces that it was awarded a 2013 Global Technology Award in the category of “Placement – Medium to High Volume” for its RX-6 Flex Placer. T
Industry News | 2016-08-28 13:28:32.0
Saki Corporation will demonstrate its 2D and 3D automated optical inspection (AOI) systems at NEPCON South China in booth 1G35. Saki's AOI systems' unique Phase Measurement Profilometry technology and quad-directional side cameras inspect and measure QFNs, J-leads, and connectors, and enable the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed. NEPCON South China is being held August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.
Industry News | 2007-11-04 19:29:37.0
DORSET, UNITED KINGDOM - November 2, 2007 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display the Xpress 25 flexible high-volume SMT placement system in booth A4-125 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2015-02-16 09:46:54.0
At the upcoming AUTOMATICON 2015 exhibition, taking place March 17 - 20 in Warsaw, Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its award-winning Paraquda in booth B28, hall 1. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and/or glue and mount components in one machine.
Industry News | 2015-04-21 16:57:06.0
The Balver Zinn Group announces that they will be attending SMT/Hybrid/Packaging 2015 scheduled to take place May 5-7 in Nuremberg, Germany. They will highlight the company’s latest solder flux and paste technology in Booth #7-308.
Industry News | 2016-02-18 19:44:14.0
Europlacer will demonstrate its full line configuration, representing unparalleled flexibility and value. Core to the configuration is the ability to manage the entire SMT line without compromise.
Industry News | 2021-07-22 15:00:19.0
Technology leader ASM will present its latest innovations for the electronics manufacturing industry in a livestream on September 1, 2021. "ASM Impact – Release Summer 2021" will focus mostly on process improvements across the whole spectrum ranging from printing, inspection and placement to fully integrated software solutions. Examples include enhancement for DEK TQ and DEK NeoHorizon solder paste printers as well as for the AMS ProcessLens SPI system, along with new, smart SIPLACE feeder solutions. The event will also feature new functions and enhancements for the ASM Works smart factory suite. Another highlight will be the extensive capabilities of the ASM Factory Equipment Center solution for company-wide and non-proprietary asset and maintenance management. For more details about the event and to register, visit https://asm-smt-events.com/.
Industry News | 2023-05-30 03:58:24.0
In the ever-evolving world of electronics manufacturing, choosing the right method for printed circuit board (PCB) assembly is crucial. Two popular methods that have gained prominence over the years are surface mount technology (SMT) and through-hole technology. Each method has its own strengths and considerations, and understanding their differences is essential for making an informed decision. In this article, we will explore the advantages, factors to consider, application considerations, and industry trends related to SMT and through-hole technologies, helping you choose the right method for your specific requirements.
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