Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2011-04-22 21:36:56.0
GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2003-06-18 07:56:46.0
The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Industry News | 2003-04-17 08:15:33.0
In launching the LA35 series, SMAC reckons it has produced an actuator with unrivalled versatility.
Industry News | 2003-03-18 10:12:41.0
The Falcom JP7 is a single-board GPS receiver with 12 parallel channels.
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
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