Industry News: smt werheim 300c (Page 1 of 1)

New Innovative Solder Joint Encapsulant Paste: SMT 256EP

Industry News | 2017-06-05 15:45:06.0

YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).

YINCAE Advanced Materials, LLC.

Reflow oven with new design and software update

Industry News | 2012-07-29 03:36:45.0

Glichn has expanded its reflow oven series dedicated to bench top solder oven. Included are updates of existing software and different PCB size that combines high performance with easy operation and economical benefits.

Beijing Glichn S&T Development Co.,Ltd

MANNCORP �HI OUTPUT� TURNKEY LINE TARGETS MID TO HIGH-VOLUME FLEXIBLE SMT ASSEMBLY

Industry News | 2008-07-19 12:18:17.0

An automated turnkey line now offered by Manncorp includes a 4-head pick and place that provides assets of speed, flexibility and fast changeover. The �Hi Output Line� also includes an inline fully automatic stencil printer, an 8-zone reflow oven and pass-through conveyor, priced below $180,000 complete. According to CEO Henry Mann, �The 10,500 cph placement speed allows mid-volume assemblers to step-up throughput while benefitting from the increased savings and service advantages of purchasing the entire line from a single-source provider.�

Manncorp

Essemtec to Exhibit at Mexitr�nica 2007

Industry News | 2007-10-08 23:25:30.0

ESSEMTEC, a leading manufacturer of surface mount technology production equipment, announces that it will showcase several SMT production systems in distributor Torenko & Associates� booth at the upcoming Mexitr�nica exhibition, scheduled to take place October 23-25, 2007, at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

ESSEMTEC AG

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KingFei SMT Tech
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