Industry News | 2023-01-09 18:39:37.0
With its rule-breaking wave solder alloy, SN100C, Nihon Superior Co., Ltd. earned global recognition as an innovator in lead-free solder formulation. The rule that SN100C broke was that you can't make a Pb-free solder without a silver content that doubles the cost of the raw materials. Now Nihon Superior has broken that rule again with SN100CV, a reflow soldering alloy that can outperform SAC305 in reliability while being reflowable with the same thermal profile as SAC305.
Industry News | 2016-02-18 00:22:10.0
Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China.
Industry News | 2011-09-28 19:37:44.0
Nihon Superior introduces the new Selector Guide for SN100C solder pastes.
Industry News | 2016-11-14 11:44:29.0
Kester is proud to announce the launch of SF855-LR Soldering Flux, a low solid, low residue, no-clean non-rosin organic flux designed specifically for use in tabber and stringer equipment of Photovoltaic Assembly (PV) through soldering tabs to cell contacts. The extremely low solids content (1.6%) and nature of the activator system results in practically no residue left on the cell after soldering. SF855-LR has a wide operating window and temperature range, and can be used in SnPb, SnAgPb and Pb-free applications.
Industry News | 2009-03-06 15:54:16.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
Industry News | 2012-09-17 16:26:16.0
Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012
Industry News | 2008-02-29 16:42:42.0
ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2011-10-16 00:20:48.0
Nihon Superior announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011.
Industry News | 2019-03-05 17:59:34.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.
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