Industry News | 2014-06-10 11:59:03.0
(Albany, NY) June 10, 2014. YINCAE Advanced Materials, LLC is pleased to announce the availability of a series of new encapsulant products that enable greater production temperature flexibility for microchips with different alloy applications.
Industry News | 2013-11-08 17:55:20.0
Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13-14 in Costa Mesa, California.
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2020-01-07 11:42:27.0
Practical Components announces that it will showcase its advanced technologies at the IPC APEX exhibition in booth 1600 scheduled to take place February 4-6, 2020 at the San Diego Convention Center in San Diego California.
Industry News | 2023-09-04 13:34:43.0
Indium Corporation® is proud to showcase its proven products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at The Battery Show, September 12-14, in Novi, Michigan.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2023-08-29 07:21:26.0
Indium Corporation® is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at productronica India, September 13-15, in Bengalaru. A strong supporter of the Make in India campaign, Indium Corporation is committed to serving the region's growing EV market.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Industry News | 2016-04-26 10:26:58.0
SHENMAO Technology, Inc. will present the technical paper “A New Dispensing Solder Paste for Laser Soldering Technology” at the 10 th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
Industry News | 2022-02-10 17:05:35.0
The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporation's Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
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