Industry News | 2012-01-13 12:42:50.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Senior Technical Advisor Keith Sweatman will present “The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints” at the SMTA Pan Pacific Microelectronics Symposium.
Industry News | 2012-02-07 16:20:22.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo.
Industry News | 2010-09-02 10:54:09.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that the research it sponsored at the University of Queensland, Australia provided the basis for the paper that earned an ICEP Outstanding Paper Award.
Industry News | 2011-03-01 16:38:55.0
Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.
Industry News | 2016-02-20 20:36:54.0
Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2013-09-17 15:25:45.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas.
Industry News | 2011-10-16 00:20:48.0
Nihon Superior announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011.
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