Industry News: sn63pb37 extremely low temperature (Page 1 of 20)

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

SMTA International 2015 Best Papers Announced

Industry News | 2016-01-26 16:30:02.0

The SMTA is pleased to announce the Best Papers from SMTA International 2015. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.

Surface Mount Technology Association (SMTA)

Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards

Industry News | 2020-01-29 07:33:26.0

IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

IPC INTERNATIONAL ACADEMIC COMPETITION WINNERS TO PRESENT RESEARCH AT IPC APEX EXPO 2012

Industry News | 2012-01-10 19:20:12.0

IPC announced the winning research papers selected in the 2012 IPC International Academic Paper Competition.

Association Connecting Electronics Industries (IPC)

I.C.T SMT Vacuum Reflow Oven Machine

Industry News | 2022-10-13 07:44:15.0

I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates

Dongguan Intercontinental Technology Co., Ltd.

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Industry News | 2017-01-29 09:37:08.0

TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

Speedline Technologies, Inc.

Kester to Feature Lead-Free Information Center at APEX 2008

Industry News | 2008-02-29 16:42:42.0

ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.

Kester

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Industry News | 2018-12-08 03:24:24.0

RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ

Flason Electronic Co.,limited

Temperature Cycling Test Chambers: Product Stability Test When Exposed to Extreme Temperature

Industry News | 2020-11-19 20:55:18.0

Temperature cycling test or thermal cycle testing is done on substances to determine the immunity of vulnerability to alternating extremes of low and high temperatures. You can utilize temperature cycling test chambers to test nearly all commercial goods to determine how they withstand extreme temperature changes. The intent of analyzing a product under these conditions is to detect changes in the goods' characteristics and assess the failure incidence of distinct substances and thermal expansion coefficients.

Guangdong Bell Experiment Equipment Co.,Ltd

SHENMAO Offers Quality Low-Temperature Solder Paste for SMT Devices

Industry News | 2019-05-20 18:51:08.0

SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste. Qualified by a third-party organization, the PQ10 series of low temperature solder paste is made with a modified Sn/Bi alloy that has a lower melting point range from 137°~142°C to 137°~170°C. This makes it ideal for SMT devices, which can have sensitive components that cannot withstand higher temperatures.

Shenmao Technology Inc.

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