Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Industry News | 2024-06-18 07:29:58.0
Regulus's ultra low temp Li-polymer battery retains over 90% capacity at -40°C, revolutionizing general Li-polymer batteries (0°C to 40°C). Curious about our advanced battery solutions? Contact us today for more details!
Industry News | 2012-02-10 15:56:15.0
The new Polyonics double-coated tapes are ideal for bonding materials that will be exposed to extremly high temperatures and harsh manufacturing environments. They include liners that are designed to be die cut and, due to their additional stiffness compared to transfer adhesives, can be easily auto-applied.
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2016-01-20 10:43:07.0
With “Securo”, Rehm Thermal Systems offers a new series for reliable hot and cold function tests Electronic components in safety-relevant applications such as medical, automotive and aerospace technology must function 100 % reliably under all temperature conditions. To analyse the reliability of electronics under extreme temperatures, Rehm Thermal Systems has developed a completely new series: Securo Plus for hot function tests and Securo Minus for cold function tests. The systems can simulate precisely these extreme environmental conditions by selectively heating or cooling the component.
Industry News | 2022-04-13 10:04:24.0
SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.
Industry News | 2013-01-21 08:57:51.0
Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
Industry News | 2023-08-14 12:12:00.0
SHENMAO America, Inc. is pleased to announce the availability of its PF735-LT201 Low-Temperature Lead-Free No-Clean Solder Wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, offering exceptional solderability and reliability for low-temperature PCBA soldering and rework processes.
Industry News | 2013-02-26 16:18:07.0
Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.
Industry News | 2019-07-09 20:13:00.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.
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