Industry News | 2016-01-20 10:43:07.0
With “Securo”, Rehm Thermal Systems offers a new series for reliable hot and cold function tests Electronic components in safety-relevant applications such as medical, automotive and aerospace technology must function 100 % reliably under all temperature conditions. To analyse the reliability of electronics under extreme temperatures, Rehm Thermal Systems has developed a completely new series: Securo Plus for hot function tests and Securo Minus for cold function tests. The systems can simulate precisely these extreme environmental conditions by selectively heating or cooling the component.
Industry News | 2022-04-13 10:04:24.0
SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.
Industry News | 2013-01-21 08:57:51.0
Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
Industry News | 2013-02-26 16:18:07.0
Engineered Material Systems debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices.
Industry News | 2019-07-09 20:13:00.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.
Industry News | 2021-08-12 20:58:16.0
When we use the Refrigeration Compressors, there could be frosting. It's a failure that we can solve. So this article will take you to look at the reasons for frosting and the corresponding solutions.
Industry News | 2013-03-18 09:41:07.0
BTU Europe Ltd.,will highlight solutions to enhance customer value in Booth #7-555 at the upcoming SMT/Hybrid/Packaging exhibition and conference, scheduled to take place 16-18 April 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2018-06-17 16:55:59.0
SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
Industry News | 2018-07-08 18:45:56.0
SHENMAO America, Inc. today announced plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 12, 2018 at the Embassy Suites Cleveland Rockside. Company representatives will showcase the new PQ10 Low Temperature Solder Paste.
Industry News | 2019-04-15 06:42:26.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.
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