Industry News: sn63pb37 extremely low temperature (Page 3 of 20)

BTU Europe to Debut New Value-Added Solution to Europe during SMT Nuremberg

Industry News | 2013-03-18 09:41:07.0

BTU Europe Ltd.,will highlight solutions to enhance customer value in Booth #7-555 at the upcoming SMT/Hybrid/Packaging exhibition and conference, scheduled to take place 16-18 April 2013 at the Messezentrum in Nuremberg, Germany.

BTU International

Kester Launches SF855-LR Soldering Flux

Industry News | 2016-11-14 11:44:29.0

Kester is proud to announce the launch of SF855-LR Soldering Flux, a low solid, low residue, no-clean non-rosin organic flux designed specifically for use in tabber and stringer equipment of Photovoltaic Assembly (PV) through soldering tabs to cell contacts. The extremely low solids content (1.6%) and nature of the activator system results in practically no residue left on the cell after soldering. SF855-LR has a wide operating window and temperature range, and can be used in SnPb, SnAgPb and Pb-free applications.

Kester

New Low-Temperature Solder Paste from SHENMAO

Industry News | 2018-06-17 16:55:59.0

SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

Shenmao Technology Inc.

New Low Temperature Solder Paste from SHENMAO at SMTA Ohio

Industry News | 2018-07-08 18:45:56.0

SHENMAO America, Inc. today announced plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 12, 2018 at the Embassy Suites Cleveland Rockside. Company representatives will showcase the new PQ10 Low Temperature Solder Paste.

Shenmao Technology Inc.

SHENMAO to Exhibit Low-Temperature Solder Pastes at ECTC

Industry News | 2019-04-15 06:42:26.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.

Shenmao Technology Inc.

Stamped Spring Pin BGA Socket for Burn-in Characterization

Industry News | 2011-02-03 14:21:01.0

Ironwood Electronics recently introduced a new BGA socket addressing burn-in characterization requirements for BGA devices - CBT-BGA-6011.

Ironwood Electronics

Orchid Technologies Designs Solar Power System

Industry News | 2009-09-18 13:59:46.0

Orchid Technologies’ custom high capacity energy storage designs are proven safe and tough.

Orchid Technologies Engineering & Consulting, Inc.

SHENMAO Picks up Award for New Low Temperature Solder at SMTA Guadalajara

Industry News | 2019-10-24 16:29:44.0

SHENMAO America, Inc. announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

Shenmao Technology Inc.

SHENMAO Awarded for New Low Temperature Solder at productronica

Industry News | 2019-11-13 11:33:38.0

SHENMAO America, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.

Shenmao Technology Inc.

SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions

Industry News | 2020-05-30 12:34:54.0

SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

Shenmao Technology Inc.


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