Industry News | 2016-05-13 11:56:03.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2016-05-13 12:00:12.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2011-03-22 16:23:31.0
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for BGA devices - CBT-BGA-6014.
Industry News | 2021-12-26 20:13:58.0
1. Reasons of High Temperature Breakdown 1.1 Environmental Factors Ambient temperature may not be the main cause of high temperature shutdown, but it is often the inducement of compressor high temperature shutdown. Generally, technicians have a design operating environment temperature (30-40 ℃) when designing compressors. When the air compressor is operated under the designed operating environment temperature, its maximum temperature is close to the protection temperature of the air compressor.
Industry News | 2015-07-06 19:08:22.0
Seika Machinery now carries the MALCOM RDT-250C Reflow Simulator. The system can reproduce the temperature profile of a reflow oven while allowing operators to observe the melting state of solder paste and record the process.
Industry News | 2009-03-10 18:11:53.0
NORTH BILLERICA, Mass., January 2009 � BTU International (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will feature the Pyramax 100A at the upcoming APEX exhibition. The oven will be on display in booth #2424 at the Mandalay Bay Resort and Conference Center in Las Vegas, Nevada, March 31-April 2, 2009.
Industry News | 2012-04-24 13:45:13.0
BTU International (NASDAQ: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, will highlight its PYRAMAX™ 100A at the upcoming SMT Nuremberg 2012 exhibition.
Industry News | 2009-12-08 15:08:44.0
Reinhausen Plasma will be presenting the first ever cold-active plasma tools at the productronica – the Plasmabrush, Piezobrush and Plasmadust. The innovative Plasmabrush and Piezobrush open up a whole range of new application fields with regard to the pre-treatment and activation of substrate surfaces.
Industry News | 2019-08-12 20:00:01.0
SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”
Industry News | 2009-12-08 14:33:47.0
The compact, portable handset for cost-effective plasma surface activation.
