Industry News | 2022-11-15 12:33:16.0
SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
Industry News | 2019-04-01 19:56:55.0
SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.
Industry News | 2009-06-08 23:35:30.0
Advancing the performance of electrically conductive film technology, Henkel has developed and launched Emerson & Cuming� CF3366�, a ground-breaking film technology that offers a robust alternative to traditional conductive materials.
Industry News | 2013-03-13 13:36:45.0
ADLINK Technology releases its newest Extreme Rugged™ CoreModule® offering. The ADLINK CoreModule® 920, with outstanding mechanical, thermal and power design, is able to support Intel® Core™ i7 performance with low power consumption in a small PC/104 form factor, making it an ideal choice for mission-critical applications in space-constrained environments such as transportation, aviation and defense/homeland security.
Industry News | 2019-01-05 16:26:04.0
SHENMAO America is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.
Industry News | 2014-01-09 10:39:28.0
Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Industry News | 2014-03-31 16:21:29.0
Engineered Material Systems debuts its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Industry News | 2023-11-20 15:25:15.0
SHENMAO Technology is proud to commemorate its 50th anniversary. Founded in 1973, SHENMAO has witnessed the evolution of Taiwan's electronics industry, playing a pivotal role in shaping the landscape of solder materials and setting new industry standards.
Industry News | 2014-12-30 08:36:58.0
ADLINK Technology, Inc. today introduced a new SMARC® form factor computer-on-module running a Freescale i.MX6 processor based on the ARM Cortex-A9 architecture. With a choice of dual or quad-core processors running at from 800 MHz to 1.2 GHz with soldered memory up to 2GB DDR3L-1066/1333.The ADLINK LEC-iMX6 delivers top-of-the-line performance with efficient power consumption that targets a new generation of mobile applications requiring industrial-grade stability and reliability and supports an extremely wide operating temperature range of -40°C to +85°C thanks to ADLINK’s proven Extreme Rugged™ technology.
Industry News | 2014-08-28 15:40:58.0
FCT Assembly announces that Development Chemist Brittney Nolan will present during the Poster Sessions at SMTA International. The presentation, entitled “The Impacts of the Environment on the Printability of Solder Paste,” will take place Tuesday, September 30, 2014 from 12-2 p.m. in the Exhibit Hall at the Donald Stephens Convention Center in Rosemont, IL.
