Industry News | 2022-02-01 21:05:46.0
Low-Smoke, Zero Halogen Cable is designed for Longer Cable Runs and Increased Signal Integrity
Industry News | 2014-09-22 02:55:09.0
Rugged SSDs and DRAM designed for the challenging environments found in fleet vehicles, military usage, and logistics industry
Industry News | 2021-08-30 21:24:05.0
In the refrigeration system of the cold storage, the refrigeration compressor is the core equipment. At present, piston refrigeration compressors are mostly used in small and medium-sized cold storage refrigeration systems. Because of the different refrigerating mediums, the compressors are often divided into ammonia type and fluorine type. This article will introduce to you common faults and ideas of piston ammonia refrigeration compressor
Industry News | 2016-12-14 17:17:56.0
In August 2016, HDA-SMC moved to a new 40,000 sq. ft., custom designed facility to house it's high tech hybrid, prototype, PCB, and electro-mechanical engineering and assembly operations. Production and operations were running at full tilt within a week and has recently been re-certified for AS9100 and NADCAP with flying colors.
Industry News | 2023-01-23 17:37:22.0
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 25‒27 in Tokyo, Japan.
Industry News | 2004-11-19 16:12:06.0
St. Charles, IL November 1, 2004 - Perllo Technologies LLC and ECM Electronics Ltd. announce the release of the new environmentally friendly ECxxC series of lead-free power inductors for introduction into the North American Automotive Market.
Industry News | 2010-12-03 22:31:01.0
Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.
Industry News | 2014-07-23 13:15:08.0
ADLINK Technology today introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability.
Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
