Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Industry News | 2003-01-29 13:23:31.0
A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package
Industry News | 2004-05-24 17:45:54.0
The new devices are designed for low-side operation in synchronous buck (single- and multi-phase configurations) dc to dc converters.
Industry News | 2005-11-29 11:31:48.0
New Siliconix Power MOSFETs in Thermally Enhanced PowerPAK 1212-8 Package Combine 3.3 mm by 3.3 mm Footprint, Thermal Resistance of Less Than 2 Degrees Celsius Per Watt, and On-Resistance Values Down to 3.7 Milliohms
Industry News | 2005-12-15 16:01:05.0
PolarPAK Power MOSFETs With Double-Sided Cooling Offer On-Resistance Down to 1.9 Milliohms Maximum
Industry News | 2004-05-24 17:35:44.0
Si7820DN�s Small Size and High Power Capability Are Essential to Implementation of New Sub-Brick DC/DC Power Architectures
Industry News | 2017-09-12 10:05:15.0
Do you have XRAY model HP/Agilent 5DX? Are you aware that the analysis of soldering quality from XRAY data (despite limits and distribution) can improve product quality? Can you easily and quickly perform SPC calculations on XRAY data for different aspects, attributes, productions and more?
Industry News | 2004-08-09 16:13:02.0
Two new common-drain, chipscale power MOSFETs that are the industry�s first such p-channel and 30-V n-channel devices were announced today by Siliconix incorporated.
Industry News | 2003-06-30 17:15:36.0
New power MOSFETs built on a breakthrough TrenchFET� technology that combine greatly reduced switching losses with ultra-low on-resistance were announced by Siliconix incorporated.
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