Industry News | 2016-10-26 14:55:50.0
Vass, NC – Sept 20, 2016 – PACE Worldwide announces an introductory promotion in conjunction with the launch of their new TF 1800 BGA/SMD Rework System, which began shipping in October. For a limited time, PACE will provide 10 Heat Focusing Nozzles free of charge with the purchase of each TF 1800 System, a value of over $3,400 (£2,700/€3,340).
Industry News | 2004-11-02 17:11:37.0
Feature 1-A Output Drivers, Switching Frequencies up to 1 MHz
Industry News | 2013-03-01 13:33:11.0
Melexis, a mixed signal semiconductor manufacturer headquartered in Belgium, has chosen Multitest’s Standard MT9510 Pick and Place Test Handler for an infrared, light sensing application
Industry News | 2013-09-11 10:43:09.0
LAPIS Semiconductor, a ROHM Group Company, has recently developed 8-bit microcontrollers equipped with an oscillator circuit that provides more than twice the accuracy compared with previous models.
Industry News | 2022-03-30 12:41:51.0
MCXL Embedded Module Relies on Intel Cyclone 10 LP FPGAs and HyperBus Technology for Industrial Control and Communications
Industry News | 2024-03-18 11:56:33.0
Seika Machinery, Inc. is gearing up to showcase its latest advancements at Booth 4012 during the 2024 IPC APEX EXPO, slated to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to excellence and technological innovation, Seika Machinery will present an array of state-of-the-art equipment and systems designed to optimize production processes and enhance manufacturing efficiency.
Industry News | 2009-12-02 21:17:33.0
Altium releases smart prototyping peripheral board for its NanoBoard FPGA-based development platforms.
Industry News | 2022-04-13 10:29:39.0
Heraeus Electronics today announced plans to exhibit in Hall 6, Booth 322 at PCIM Europe, the leading conference and exhibition for power electronics, renewable energy and energy management. The event is scheduled to take place May 10-12, 2022 in Nuremberg. In parallel to PCIM Europe, SMTconnect will take place in halls 4, 4A and 5.
Industry News | 2024-02-07 14:03:28.0
Charlotte, North Carolina – The Carolinas Chapter of the SMTA is hosting an evening dinner presentation on Thursday, February 22, 2024 from 6:00 - 8:00 pm ET at East West Charlotte in Mooresville, NC with CeTaQ General Manager Michael Sivigny, who will present on ways to improve SMT quality. Special thanks to our site sponsor, East West Manufacturing. Additional information about the event and the registration form is found at the following link: https://smta.org/events/EventDetails.aspx?id=1829872&group=225181.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.