Industry News | 2009-12-07 18:40:41.0
Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will debut its XPii modular pick-and-place system in Hall A2, Stand 439 of the upcoming Productronica exhibition, scheduled to take place November 10-13, 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2010-08-02 11:35:31.0
Test Equipment Connection announced today that it has entered into a Distribution Agreement to sell new Bluelight telecom test equipment including portable handheld 1GbE and 10GbE BlueScope testers.
Industry News | 2011-02-24 21:33:45.0
JEDEC Solid State Technology Association today announced the publication of its next-generation storage system standard, Universal Flash Storage (UFS). UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers.
Industry News | 2011-06-14 14:37:55.0
The white light axial chromatism technique utilized by Nanovea’s 3D Non Contact Profilometers has become widely known as a vital bench top research and verification tool. It is now the Automated Optical Inspection (AOI) environments that have begun to acknowledge Nanovea’s superior capability. Unlike the traditional vision and laser systems that typically sacrifice one feature for another, speed or resolution, Nanovea provides both. Vision and laser systems also have very limited automated surface measurement options, where as Nanovea’s system provides a wide range including: Profile, Dimension, Roughness, Shape & Form, Flatness & Planarity, Volume Area, Step-Height Depth and Thickness. And keep in mind, the technique utilized by Nanovea’s inspection system has the superior ability to measure nearly any material surface and zero influence from sample reflectivity or absorption.
Industry News | 2012-01-10 19:17:29.0
Adept Technology will be demonstrating groundbreaking new automated solutions for material handling and logistics to MODEX show attendees in their Booth 4228 at Atlanta's Georgia World Congress Center from February 6 - 9, 2012.
Industry News | 2012-05-29 12:57:35.0
Yestech Europe launched the Nordson YESTECH new, high-speed FX SL advanced Automated Optical Inspection (AOI) system into Europe at the SMD Hybrid Packaging 2012 exhibition.
Industry News | 2012-11-06 15:19:48.0
Mentor Graphics announced its new Tessent® IJTAG solution, which allows designers to easily reuse test, monitoring and debugging logic embedded in existing IP blocks. Supporting the IEEE P1687 (IJTAG) standard, the solution automatically retargets test and debug commands and generates an integrated hierarchical control and data network with a single top-level interface for an entire SoC.
Industry News | 2013-02-12 10:50:00.0
Europlacer a manufacturer of market-leading flexible SMT placement machines, debuts Project iico, a concept that combines outdated systems with new, innovative parts to result in an environmentally smart, technologically advanced assembly system.
Industry News | 2013-11-08 19:18:10.0
Gen3 Systems will exhibit with its distributor, Stannol, in Hall A4, Stand 470 at the productronica International Trade Fair.
Industry News | 2013-11-15 17:04:20.0
The popularity of jet printing technology to apply solder paste to printed circuit boards is growing fast as more and more electronics manufacturers understand the key advantages over traditional methods of solder paste application, such as screen printing or dispensing. Today hundreds of electronic producers worldwide are using jet printing for a diverse range of applications – situations that demand speed, design freedom and high-quality solder joints.
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