Industry News: solder and joint (Page 24 of 260)

IPC Event Focuses on Real-world Approach to Electronics Reliability Experts from Intel, Indium and CalTech to address materials technology and testing strategies

Industry News | 2013-09-12 15:39:02.0

Subject-matter experts will provide insights into electronics reliability challenges during the IPC Conference on Solder and Reliability in Costa Mesa, Calif., November 13–14.

Association Connecting Electronics Industries (IPC)

SMTA International 2015 Concludes Successfully

Industry News | 2015-10-13 18:52:09.0

SMTA International Conference and Exhibition, which took place September 27 – October 1, 2015 at the Donald E. Stephens Convention Center in Rosemont, IL, experienced a 20% increase in on-site attendance compared to 2014. International attendance was comparable to last year with attendees representing 21 different countries.

Surface Mount Technology Association (SMTA)

SMTA International 2017 Best Papers Announced

Industry News | 2018-01-15 13:37:11.0

The SMTA is pleased to announce the Best Papers from SMTA International 2017. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.

Surface Mount Technology Association (SMTA)

SMTA International Technical Committee Announces Best Presentation & Papers Awards from the 2018 Conference

Industry News | 2019-01-30 08:13:02.0

The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.

Surface Mount Technology Association (SMTA)

IPC to Launch Educational Campaign on ITAR and Printed Boards Washington, D.C. Meetings and IPC White Paper Kick Off Initiative to Raise Awareness

Industry News | 2012-07-19 16:40:42.0

On July 25, IPC will launch its new educational campaign, Follow the Law, Protect the Board, to raise awareness and compliance with federal regulations on the export of printed boards (PCBs) designed for International Traffic in Arms Regulations (ITAR) controlled equipment

Association Connecting Electronics Industries (IPC)

Winners of IPC Hand Soldering and Rework Competition at NEPCON Vietnam 2022 Announced

Industry News | 2022-09-21 08:21:42.0

In conjunction with NEPCON Vietnam 2022, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam on September 14–16, 2022. Held for the first time in person since the COVID-19 pandemic, this ninth competition series welcomed 33 competitors from 17 Vietnamese electronics companies.

Association Connecting Electronics Industries (IPC)

SMTA SE Asia 2012 Technical Conference Attendance Increased 45%

Industry News | 2012-04-24 13:52:50.0

The SMTA South East Asia Technical Conference on Electronics Assembly Technologies that took place April 18-20, 2012, in Penang, Malaysia, was a resounding success. SMTA reported that attendance increased 45% from last year and was very well received by attendees.

Surface Mount Technology Association (SMTA)

SMTA International Technical Committee Announces Best Presentation & Paper Awards from the 2019 Conference

Industry News | 2020-03-19 13:12:42.0

The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.

Surface Mount Technology Association (SMTA)

ITW EAE Wins Vision Awards for MPM Paste Management System and Electrovert Adjustable Wave

Industry News | 2020-08-28 03:07:38.0

ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.

ITW EAE

International Wafer-Level Packaging Conference (IWLPC) Best of Conference Paper and Plans for 2010 Announced

Industry News | 2009-12-17 18:14:12.0

Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."

Surface Mount Technology Association (SMTA)


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