Industry News: solder and joint (Page 8 of 235)

Surface-mount technology

Industry News | 2018-10-18 09:15:23.0

Surface-mount technology

Flason Electronic Co.,limited

New Revision of IPC/WHMA-A-620 Released Hundreds of Enhancements Made to Cable and Wire Harness Assemblies Standard

Industry News | 2012-10-31 15:53:31.0

B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).

Association Connecting Electronics Industries (IPC)

Circuit Board Repair and Rework

Industry News | 2018-10-18 10:54:51.0

Circuit Board Repair and Rework

Flason Electronic Co.,limited

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

Volunteers Honored for Contributions to IPC and Electronics Industry Fifty Awards Presented at IPC APEX EXPO�

Industry News | 2009-04-15 23:12:38.0

BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.

Association Connecting Electronics Industries (IPC)

Working with QFNs and QFPs

Industry News | 2018-10-18 09:05:06.0

Working with QFNs and QFPs

Flason Electronic Co.,limited

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited

International Wafer-Level Packaging Conference and Exhibition

Industry News | 2011-01-18 14:37:31.0

Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.

Surface Mount Technology Association (SMTA)

PCB Design and Layout Guidelines

Industry News | 2018-10-18 11:15:12.0

PCB Design and Layout Guidelines

Flason Electronic Co.,limited

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)


solder and joint searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

Software for SMT placement & AOI - Free Download.
SMT spare parts - Qinyi Electronics

Best Reflow Oven
High Throughput Reflow Oven

Smt Feeder repair service centers in Europe, North, South America
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
Electronic Solutions R3

"Heller Korea"