Industry News: solder and mac (Page 13 of 132)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Update of IPC J-STD-609 Provides Greater Delineation of Lead-free Solders for Marking and Labeling

Industry News | 2010-04-10 02:05:54.0

IPC released today the A revision of IPC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes. This standard presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling, and now provides additional codes for the more precise specification of certain lead-free solders.

Association Connecting Electronics Industries (IPC)

Lead Free Solders and Embedded Passives Headline Professional Development Schedule at 2003 IPC Annual Meeting

Industry News | 2003-07-08 09:48:46.0

taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.

Association Connecting Electronics Industries (IPC)

14th Annual Pan Pacific Microelectronics Symposium Registration Open and Program Announced

Industry News | 2008-10-13 18:04:29.0

Minneapolis, MN � Registration is now open and the program is finalized for the 14th Annual Pan Pacific Microelectronics Symposium & Exhibit taking place February 10 - 12, 2009 at the Hapuna Beach Prince Hotel on the Big Island of Hawaii. The conference promotes international technical interchange and provides a premier forum for extensive networking among industry professionals and business leaders throughout the world.

Surface Mount Technology Association (SMTA)

AIMS Harsh Environments Symposium To Address Thermo-Mechanical Analysis, Metallization, and Reliability of Lead-Free Solders

Industry News | 2011-07-14 11:02:39.0

The SMTA announced that the AIMS Harsh Environments Symposium will be held on October 17, 2011 as a focused symposium at SMTA International in Ft. Worth, TX.

Surface Mount Technology Association (SMTA)

International Conference on Soldering and Reliability (ICSR) Best of Conference Announced

Industry News | 2013-06-26 09:09:19.0

The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.

Surface Mount Technology Association (SMTA)

Nordson Electronics Solutions offers their latest dispensing, conformal coating, and selective soldering technologies at SMTConnect 2022

Industry News | 2022-04-20 14:11:14.0

Nordson Electronics Solutions offers their latest dispensing, conformal coating, and selective soldering technologies at SMTConnect 2022

Nordson Electronics Solutions

How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality

Industry News | 2018-10-18 10:04:27.0

How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality

Flason Electronic Co.,limited

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)


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