Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2010-04-12 17:02:19.0
Minneapolis, MN - The SMTA proudly announces three upcoming offerings of SMT Processes Certification in Toronto, Minneapolis, and Cleveland. The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
Industry News | 2012-02-28 14:00:06.0
IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2003-06-09 08:40:10.0
The Opening Session and Annual Meeting during SMTA International will be held on Tuesday, September 23.
Industry News | 2022-05-18 12:46:50.0
Committee Awards presented at IPC SummerCom 2022
Industry News | 2011-04-07 18:36:27.0
The SMTA proudly announces four upcoming offerings of SMT Certification in Toronto, Schaumburg, Santa Clara, and Fort Worth. The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
Industry News | 2013-04-29 16:22:20.0
IPC — Association Connecting Electronics Industries® announces the release of a new DVD containing the photos and illustrations found in IPC/WHMA-A-620B, Requirements and Acceptance for Cable and Wire Harness Assemblies.
Industry News | 2018-10-18 08:05:54.0
The benefits of hard oxidation treatment of wave soldering mahcine and reflow oven guide Rail
Industry News | 2010-09-26 14:42:22.0
Extending its training and knowledge-based resources and services to Indian electronics manufacturing facilities on a local level, IPC — Association Connecting Electronics Industries® has opened its first office in India. Located in South Bangalore, close to the well-known Electronics City, IPC India, a wholly-owned subsidiary of IPC, will be under the leadership of Managing Director Mr. Akshinthala Vijayendra.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.