Industry News: solder and past (Page 18 of 410)

Volunteers Honored for Contributions to Electronics Manufacturing Industry and IPC

Industry News | 2012-02-28 14:00:06.0

IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

SMTA International Opening Session and Annual Meeting Announced

Industry News | 2003-06-09 08:40:10.0

The Opening Session and Annual Meeting during SMTA International will be held on Tuesday, September 23.

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK and Demant A/S Celebrate 20 Years of Business Together

Industry News | 2019-09-25 16:22:29.0

Nordson ASYMTEK announces that it has celebrated 20 years of supplying fluid dispensing equipment to Demant A/S, a world-leading manufacturer of hearing aid brands that include Oticon, Bernafon, and Sonic. During this history, Nordson technologies have enabled Demant to design smaller and more capable hearing aids.

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK's Vortik® Series of progressive cavity pumps dispenses one- and two-component fluids during electronics manufacturing

Industry News | 2019-11-12 13:03:48.0

Easy set-up and very low flow rates for two-component fluids result in precise, small deposits and narrow lines

ASYMTEK Products | Nordson Electronics Solutions

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK acquires Infiniti Dosing o.m.s. product lines to expand fluid dispensing options for mini, micro, and nano electronics applications

Industry News | 2018-01-08 18:24:10.0

Nordson ASYMTEK announces that it has acquired the rights and assets to progressive cavity pump (PCP) product lines from Infiniti Dosing o.m.s, based in Polling, Germany. The transaction, which closed on January 5, 2018, provides Nordson ASYMTEK with dispensing and dosing products marketed by Infiniti under the Dot Streamer (DS) and Accura brands. Infiniti's owner and founder, Mr. Jean-Claude Tytgat, will join Nordson ASYMTEK and continue to work on technology developments.

ASYMTEK Products | Nordson Electronics Solutions

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Industry News | 2017-05-15 16:35:00.0

SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

SMTA China Presents Nine Best-Paper / Oustanding Paper / Best Presentation Awards and Two Best Exhibit Awards at SMTA China East 2016 Conference / Nepcon China 2016

Industry News | 2016-05-09 21:21:15.0

SMTA China announces that it presented awards for Nine papers at the SMTA China East 2016 Conference Award Presentation Ceremony, held on Tuesday, April 26, 2016 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

Solder Paste Application Standard Available in Danish IPC-7527 Establishes Two Firsts for IPC

Industry News | 2012-12-13 13:23:38.0

IPC-7527, Krav til Tinpastatryk, is also the first standard ever developed that focuses on the application of one of the industry’s most basic infrastructure elements, solder paste.

Association Connecting Electronics Industries (IPC)


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