Industry News | 2023-01-23 17:37:22.0
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 25‒27 in Tokyo, Japan.
Industry News | 2013-03-25 14:54:55.0
Aqueous Technologies, will present a cleaning and reliability workshop to address emerging trends in electronic assembly that have a significant impact on precision cleaning.
Industry News | 2011-09-19 16:30:56.0
MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.
Industry News | 2015-10-13 19:27:42.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2010-05-29 18:57:32.0
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2013-05-01 20:51:31.0
Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.
Industry News | 2015-05-24 10:37:43.0
Having produced the first book, video and interactive CD-ROM on pin in hole intrusive reflow we believe we are in a good position to help engineers achieve better yields and implement high and low temperature processes with our next PIHR webinar http://www.bobwillisonline.com/training_detail.asp?WorkshopID=129
Industry News | 2023-04-03 13:55:05.0
Indium Corporation® is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market, including cutting-edge high-reliability alloys, at productronica China, April 13-15, in Shanghai.
Industry News | 2010-09-15 21:55:19.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
