Industry News | 2016-07-11 20:50:22.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
Industry News | 2017-02-05 09:21:06.0
Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate a poorly defined process or a process and materials which are out of control With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses for solder balls. Bob’s webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. For further details go to http://www.bobwillis.co.uk/event/solder-ball-elimination-in-wave-selective-reflow/
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Industry News | 2015-12-14 22:14:22.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature-sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2015-12-16 18:10:21.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature–sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2017-03-23 11:33:40.0
Outline of PNC Inc's BGA assembly capabilities.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
