Industry News: solder ball size (Page 5 of 163)

Count On Tools Inc. Announces Expansion of PB Swiss Tools Rainbow Hex Key Series

Industry News | 2015-02-18 08:04:06.0

Count On Tools introduces PB Swiss Tools’ smaller Hex Key (allen keys) sets that are color-coded according to size and function in its Rainbow assortment. The tools are distinctively differentiated from others; thus they can be located faster in the toolbox, at the workplace or on the construction site.

Count On Tools, Inc.

Precision PCB Services, Inc. Introduces Side View Camera for BGA Inspection

Industry News | 2020-03-19 11:12:48.0

Amid the COVID 19 crisis, Precision PCB Services, Inc. remains open and cable to provide quick turn BGA Rework and Reballing Services with offices in Northern California and Dallas, Texas.

Precision PCB Services, Inc

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

Count On Tools Releases PB Swiss Tools’ Holding Ring Hex Keys

Industry News | 2010-07-16 16:42:34.0

Count On Tools Inc., a leading provider of precision components and SMT spare parts, has released PB Swiss Tools’ Holding Ring Hex Keys. The new hex keys allow fasteners to be inserted or removed in hard-to-reach locations without the fastener falling off the tool and without sacrificing strength.

Count On Tools, Inc.

Session 5 to Focus on Adhesives/Coatings at SMTA Harsh Environments Conference

Industry News | 2018-04-16 20:18:35.0

SMTA Europe announces Session 5 Technical Program on Adhesives and Coatings at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

SMTA Releases Free BGA Defect Guide for Download

Industry News | 2019-05-20 18:57:09.0

SMTA recently released the Guide to BGA Assembly & Soldering Defects, a complimentary resource for the electronics manufacturing industry. The book was written by Keith Bryant, industry veteran and Chairman of the SMTA Europe Chapter, and reviewed by members of the SMTA Europe Technical Committee.

Surface Mount Technology Association (SMTA)

COT announces new Knurled Hex Keys from PB Swiss Tools

Industry News | 2017-10-05 19:03:43.0

Count On Tools is pleased to announce that PB Swiss Tools now offers knurled hex keys as a standard option in their product catalog. The knurling at the shaft increases the non-slip property in wet or oily environments, thereby increasing the safety. The round shaft, manufactured from PB Tools’ unique steel alloy guarantees higher reverse fatigue strength. The new knurled hex keys from PB Swiss Tools is available in sizes 1.5mm –10mm as individual hex key l-wrenches or as a set in a handy plastic holder.

Count On Tools, Inc.

I.C.T SMT Vacuum Reflow Oven Machine

Industry News | 2022-10-13 07:44:15.0

I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates

Dongguan Intercontinental Technology Co., Ltd.

Donald Tyler, Corfin, to Present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip” at the SMTA Capital Chapter Meeting March 17th

Industry News | 2015-03-11 18:05:46.0

The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.

Surface Mount Technology Association (SMTA)


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