Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Industry News | 2012-06-01 09:09:55.0
Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.
Industry News | 2023-10-23 09:52:43.0
TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2020-05-12 11:44:16.0
Thermaltronics USA, Inc. announces that it has added a new product to its solder robot range: the TMT-R8000S. The system simplifies and automates hand soldering processes with precision ball screws, servo motors and industry-leading software.
Industry News | 2023-07-19 09:52:10.0
The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.
Industry News | 2009-03-10 16:11:29.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2018-12-13 03:35:05.0
Pick And Place Machine
