Industry News: solder ball under component (Page 13 of 75)

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Practical Components Introduces New Kit for Test and Qualification of the Amkor TMV® Component

Industry News | 2011-06-13 18:06:01.0

Practical Components announces that the new Practical Components TMV® (Through Mold Via) 14 mm Board Drop Test Lead-Free Kit is now available. The kit is designed for the 14 mm Amkor TMV® component.

Practical Components, Inc.

Cobar Europe Introduces New Products from Yincae Advanced Materials

Industry News | 2010-09-16 21:44:04.0

The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.

Cobar Solder Products Inc.

Universal Instruments’ APL Hosts Initial 2010 AREA Consortium Meeting

Industry News | 2010-07-29 15:10:06.0

Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.

Universal Instruments Corporation

PDR's New Affordable PCB X-ray Inspection Systems Offer Quality Image Clarity

Industry News | 2020-06-07 04:44:33.0

PDR X-ray Solutions is pleased to announce that its 2D and 2D+ X-ray systems have set a new industry standard for high-quality X-ray images at an affordable price. Choosing the correct system for your requirements such as X-ray for quality control or X-ray for process control is vital for the success of both X-ray circuit board inspection programs as well as X-ray semiconductor inspection programs.

PDR-America

What is a Ball Grid Array?

Industry News | 2018-10-18 10:22:15.0

What is a Ball Grid Array?

Flason Electronic Co.,limited

OK International will showcase assembly and rework technology advances at IPC/ APEX EXPO 2011

Industry News | 2011-03-17 17:48:27.0

The OK International team will display and demonstrate its full range of soldering and production assembly technologies at this year’s IPC/APEX Expo in Las Vegas, April 12-14. These industry-leading solutions will be fully operational at booth # 1634, including advanced soldering, desoldering and rework systems, programmable pre-heaters, fume extraction and a comprehensive range of dispensing technologies.

OK International

Murrietta Circuits Offers Re-Tinning Services

Industry News | 2012-10-29 15:37:50.0

Murrietta Circuits now offers an entire menu of Re-Tinning capabilities

Murrietta Circuits

BTU International Adds Hentec/RPS Selective Soldering Equipment to Its Product Line

Industry News | 2021-03-02 13:18:53.0

Vector and Valence series offer unmatched thermal capability, featuring rapid programming, and simplistic elegance in operation.

Hentec Industries, Inc. (RPS Automation)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited


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