Industry News: solder ball under component (Page 18 of 75)

Nihon Superior to Exhibit at Electronics For You Expo 2012 (EFYEXPO2012)

Industry News | 2012-01-24 15:15:34.0

Nihon Superior (Singapore) Pte. Ltd. will showcase a new, expanded range of SN100C products in booth B-74B at the upcoming Electronics For You Expo 2012 , scheduled to take place February 16-18, 2012 in Hall No. 11 B, at the Pragati Maidan in New Delhi, India.

Nihon Superior Co., Ltd.

SHENMAO Presents Technical Paper at SMTA/ICSR Conference

Industry News | 2016-04-21 00:17:09.0

SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.

Shenmao Technology Inc.

Hentec/RPS to Exhibit Complete Product Lineup at IPC APEX EXPO

Industry News | 2021-11-29 14:55:05.0

A full range of automated selective soldering machines, component lead tinning systems and solderability test equipment will be on exhibit.

Hentec Industries, Inc. (RPS Automation)

OK International’s Newest Advanced Package Rework Solution Exceeds Industry Expectations

Industry News | 2012-06-18 20:06:38.0

OK International announces that the new Metcal Scorpion Rework System has received a significant amount of positive industry attention, including the prestigious 2012 EM Asia Innovation Award in the category of Repair/Rework Equipment.

OK International

Hentec/RPS Setting Component Lead Tinning Standards and Compliance

Industry News | 2021-03-30 16:42:31.0

Odyssey component lead tinning machines provide high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

Hentec/RPS to Participate in IPC APEX EXPO 2021 Virtual Event

Industry News | 2021-02-17 11:49:45.0

A full range of automated selective soldering machines, component lead tinning machines and solderability test equipment will be on exhibit.

Hentec Industries, Inc. (RPS Automation)

Preview for Seica SMT Nuremberg May 16-18, 2017 Booth # 4A-300. In the limelight: Industrial Monitoring and Automation

Industry News | 2017-05-05 12:26:30.0

Seica will be showcasing the new Factory DashBoard solution at the SMT exhibition. The solution has been conceived with a special focus towards energy saving requirements and predictive monitoring of events, in compliance with the principles of Industry 4.0. All systems on the booth will integrate Seica's industrial monitoring hardware, and visitors will be able to see the software and mobile tools that provide 'real time' information to assist plant managers in assessing the status of all the equipment in the plant.

SEICA SpA

Cobar Solder Products Inc. at IPC APEX EXPO 2018

Industry News | 2018-01-18 04:01:33.0

Cobar Solder Products Inc. part of the Balver Zinn Group announces that it will exhibit together with Amerway Inc. in Booth #2502 at the IPC APEX EXPO, scheduled to take place February 27 – March 1, 2018 at the San Diego Convention Center, California.

Balver Zinn

Ball Grid Array Inspection

Industry News | 2018-10-18 09:58:15.0

Ball Grid Array Inspection

Flason Electronic Co.,limited

Practical Components Adds 0.3 mm Pitch Dummy CVBGA Test Vehicle to Lineup

Industry News | 2011-11-08 14:17:32.0

Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT).

Practical Components, Inc.


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