Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2017-11-15 20:34:16.0
SEHO Systems GmbH is pleased to announce that it was awarded a 2017 Global Technology Award in the category of Soldering – Selective for its Integrated Additional Processes in Selective Soldering Systems. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. The SEHO PowerSelective and SEHO SelectLine selective soldering systems can be equipped with an automated selective brush system and an AOI system for immediate automatic cleaning and inspection of solder joints directly after the soldering process. All processes are integrated in ONE machine.
Industry News | 2009-08-19 13:06:06.0
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2017-01-18 05:21:35.0
This photo CD ROM provides the process or quality engineer with a source of PIHR photographs of the assembly process, components and process defects which may be used in company inspection document or training presentations. They may be simply pasted into any document for in house company use. Now over 250 photographs are provided in either jpg or tif file format for use in PowerPoint, Word inspection standards or online publications royalty free http://www.bobwillis.co.uk/product-category/photo-cd-rom/
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
