Industry News: solder bead (Page 1 of 3)

GPD Global Pushes the Limits for Small Volume Dispensing The new Nano-Piston Pump is now available

Industry News | 2013-10-10 09:56:45.0

GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.

GPD Global

PCB Test Point Provide Easy Component Access

Industry News | 2003-06-13 09:56:46.0

Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.

SMTnet

Time Temperature setting wave soldering is the most important in the solder melts

Industry News | 2018-10-18 09:27:40.0

Time Temperature setting wave soldering is the most important in the solder melts

Flason Electronic Co.,limited

How to Solder a Surface Mount Device to a PCB Pad

Industry News | 2018-10-18 09:02:41.0

How to Solder a Surface Mount Device to a PCB Pad

Flason Electronic Co.,limited

Electronic Components, Parts and Their Function

Industry News | 2018-12-08 03:22:25.0

Electronic Components, Parts and Their Function

Flason Electronic Co.,limited

Solder Ball Elimination – In Wave, Selective & Reflow Webinar

Industry News | 2017-02-05 09:21:06.0

Solder balls and solder beading have been a process issue for many years and they may not cause product failure or quality problems but they are not desirable. Solder balls are caused by a variety of factors in different processes and should be resolved to eliminate a poorly defined process or a process and materials which are out of control With over 40 years in industry and 30 solving process problems for industry Bob Willis explains the causes and curses for solder balls. Bob’s webinar features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. For further details go to http://www.bobwillis.co.uk/event/solder-ball-elimination-in-wave-selective-reflow/

ASKbobwillis.com

Indium Corporation to Feature New Solder Paste for Fine Feature Printing at APEX 2018

Industry News | 2017-12-19 19:54:07.0

Indium Corporation will feature Indium11.8HF-SPR Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers – at IPC APEX Expo 2018, Feb. 24-March 1 in San Diego, Calif.

Indium Corporation

Hand Squeegee Stand Provides Better Hand Printing Process Control

Industry News | 2020-05-18 13:32:28.0

Transition Automation, Inc. today introduces a revised hand squeegee stand that improves the handling of solder paste for mission-critical R&D and Hand Solder Paste Printing environments. The stand serves to nest the squeegee at a specific angle to keep the solder paste bead stable on the blade during idle time between printing.The open regions around the stand provide easy access for operators to insert the squeegee into the holder. The holder also features scratch-proof nesting to keep the squeegee snug and in place if it is bumped or jostled.

Transition Automation, Inc.

Precision Assembly Technologies, Inc. uses Essemtec FOX system to solve component failure issue by bringing assembly in-house

Industry News | 2020-05-12 11:53:28.0

Precision Assembly Technologies, Inc. (P.A.T.), based in Bohemia, NY, was seeking a system that could dispense specific solder beads within a component and place the die into position within a housing. The Essemtec FOX2 multi-function combined pick-and-place and dispensing system provided the solution.The new FOX2 combines jetting/dispensing, 2.5D placement, electrical testing, inventory control and traceability in a single machine.

ESSEMTEC AG

Your Guide to Process Defect of the Month

Industry News | 2016-08-19 05:00:52.0

If you have a process problem, let NPL Defect of the Month Video help you team

ASKbobwillis.com

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